Invention Grant
- Patent Title: Optoelectronic semiconductor body and optoelectronic semiconductor chip
- Patent Title (中): 光电半导体和光电半导体芯片
-
Application No.: US13376006Application Date: 2010-05-21
-
Publication No.: US08823037B2Publication Date: 2014-09-02
- Inventor: Markus Maute , Karl Engl
- Applicant: Markus Maute , Karl Engl
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102009023849 20090604
- International Application: PCT/EP2010/057073 WO 20100521
- International Announcement: WO2010/139567 WO 20101209
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/38 ; H01L33/44 ; H01L33/20

Abstract:
An optoelectronic semiconductor body has a front face provided for the emission and/or reception of electromagnetic radiation, a rear face which lies opposite the front face and is provided for application onto a support plate, and an active semiconductor layer sequence which in the direction from the rear face to the front face includes a layer of a first conductivity type, an active layer and a layer of a second conductivity type in this sequence.
Public/Granted literature
- US20120168809A1 OPTOELECTRONIC SEMICONDUCTOR BODY AND OPTOELECTRONIC SEMICONDUCTOR CHIP Public/Granted day:2012-07-05
Information query
IPC分类: