Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13210950Application Date: 2011-08-16
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Publication No.: US08823061B2Publication Date: 2014-09-02
- Inventor: Akio Iwabuchi , Hironori Aoki
- Applicant: Akio Iwabuchi , Hironori Aoki
- Applicant Address: JP Niiza-shi
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP Niiza-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPP2010-185780 20100823
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L29/423 ; H01L29/10 ; H01L29/20

Abstract:
A semiconductor device includes: a first semiconductor layer; a second semiconductor layer; a two-dimensional carrier gas layer; a source electrode; a drain electrode; a gate electrode; and an auxiliary electrode located above the two-dimensional carrier gas layer between the gate electrode and the drain electrode. Channel resistance of the two-dimensional carrier gas layer between the gate electrode and the auxiliary electrode is set higher than channel resistance of the two-dimensional carrier gas layer between the gate electrode and the source electrode.
Public/Granted literature
- US20120043588A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-02-23
Information query
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