Invention Grant
- Patent Title: Magnetic device fabrication
- Patent Title (中): 磁性器件制造
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Application No.: US13314454Application Date: 2011-12-08
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Publication No.: US08823117B2Publication Date: 2014-09-02
- Inventor: Chewn Yu , Tien-Wei Chiang , Kai-Wen Cheng
- Applicant: Chewn Yu , Tien-Wei Chiang , Kai-Wen Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/72
- IPC: H01L29/72
Abstract:
The present disclosure provides for magnetic devices and methods of fabricating such a device. In one embodiment, a magnetic device includes a first elliptical pillar of first material layers; a second elliptical pillar concentrically disposed over the first elliptical pillar, the second elliptical pillar includes second material layers. The second elliptical pillar is smaller than the first elliptical pillar in size.
Public/Granted literature
- US20130146996A1 MAGNETIC DEVICE FABRICATION Public/Granted day:2013-06-13
Information query
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