Invention Grant
- Patent Title: Solid-state image pickup device and method for manufacturing the same
- Patent Title (中): 固体摄像装置及其制造方法
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Application No.: US13500064Application Date: 2010-10-06
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Publication No.: US08823125B2Publication Date: 2014-09-02
- Inventor: Yusuke Onuki , Yuichiro Yamashita , Masahiro Kobayashi
- Applicant: Yusuke Onuki , Yuichiro Yamashita , Masahiro Kobayashi
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc. IP Division
- Priority: JP2009-235089 20091009
- International Application: PCT/JP2010/005977 WO 20101006
- International Announcement: WO2011/043067 WO 20110414
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/06 ; H01L31/102 ; H01L31/062 ; H01L31/113

Abstract:
A solid-state image pickup device includes a photoelectric conversion portion, a charge holding portion configured to include a first-conductivity-type first semiconductor region, and a transfer portion configured to include a transfer gate electrode that controls a potential between the charge holding portion and a sense node. The charge holding portion includes a control electrode. A second-conductivity-type second semiconductor region is disposed on a surface of a semiconductor region between the control electrode and the transfer gate electrode. A first-conductivity-type third semiconductor region is disposed under the second semiconductor region. The third semiconductor region is disposed at a deeper position than the first semiconductor region.
Public/Granted literature
- US20120199934A1 SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-08-09
Information query
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