Invention Grant
US08823150B2 Optical module with a lens encapsulated within sealant and method for manufacturing the same
有权
具有封装在密封剂内的透镜的光学模块及其制造方法
- Patent Title: Optical module with a lens encapsulated within sealant and method for manufacturing the same
- Patent Title (中): 具有封装在密封剂内的透镜的光学模块及其制造方法
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Application No.: US13805260Application Date: 2011-07-04
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Publication No.: US08823150B2Publication Date: 2014-09-02
- Inventor: Kazunori Tanaka , Kazuaki Mii , Toshio Takagi , Tomomi Sano , Keitaro Koguchi
- Applicant: Kazunori Tanaka , Kazuaki Mii , Toshio Takagi , Tomomi Sano , Keitaro Koguchi
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; George L. Howarah
- Priority: JP2010-154632 20100707; JP2011-025566 20110209; JP2011-041578 20110228
- International Application: PCT/JP2011/065743 WO 20110704
- International Announcement: WO2012/005370 WO 20120112
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A method to manufacture an optical module is disclosed, wherein the optical module has an optically active device on a lead frame and a lens co-molded with the active device and the lead frame by a transparent resin as positioning the lens with respect to the lead frame. The molding die of the present invention has a positioning pin to support the lens during the molding. Because the lead frame is aligned with the molding die, the precise alignment between the active device on the lead frame and the lens is not spoiled during the molding.
Public/Granted literature
- US20130093071A1 OPTICAL MODULE WITH A LENS ENCAPSULATED WITHIN SEALANT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-04-18
Information query
IPC分类:
