Invention Grant
- Patent Title: Stacked microelectronic devices
- Patent Title (中): 堆叠的微电子器件
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Application No.: US13933607Application Date: 2013-07-02
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Publication No.: US08823159B2Publication Date: 2014-09-02
- Inventor: Seng Kim Dalson Ye , Chin Hui Chong , Choon Kuan Lee , Wang Lai Lee , Roslan Bin Said
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Priority: SG200505312-9 20050819
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.
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