Invention Grant
US08823161B2 Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures
有权
半导体芯片，半导体封装以及半导体芯片制造方法，用于减少开路故障
- Patent Title: Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures
- Patent Title (中): 半导体芯片，半导体封装以及半导体芯片制造方法，用于减少开路故障
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Application No.: US13243575Application Date: 2011-09-23
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Publication No.: US08823161B2Publication Date: 2014-09-02
- Inventor: Seong Cheol Kim
- Applicant: Seong Cheol Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2010-0121246 20101201
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L25/065 ; H01L23/48
Abstract:
A semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface, a chip pad disposed on the first surface of the substrate, and a through-silicon via (TSV) including a plurality of sub vias electrically connected to the chip pad at different positions.
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