Invention Grant
- Patent Title: Semiconductor package and method for fabricating the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US14175162Application Date: 2014-02-07
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Publication No.: US08823172B2Publication Date: 2014-09-02
- Inventor: Hwan-Sik Lim , Sunwon Kang , Jongho Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2009-0101683 20091026
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package includes a semiconductor chip having a first bump group and a second bump group, and a package substrate having a first pattern for data communication with the semiconductor chip and a second pattern for supplying power to the semiconductor chip or grounding the semiconductor chip, wherein the first bump group is disposed on the first pattern and the second bump group is disposed on the second pattern.
Public/Granted literature
- US20140151877A1 SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2014-06-05
Information query
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