Invention Grant
US08823176B2 Discontinuous/non-uniform metal cap structure and process for interconnect integration
有权
不连续/不均匀的金属帽结构和互连整合的过程
- Patent Title: Discontinuous/non-uniform metal cap structure and process for interconnect integration
- Patent Title (中): 不连续/不均匀的金属帽结构和互连整合的过程
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Application No.: US12247632Application Date: 2008-10-08
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Publication No.: US08823176B2Publication Date: 2014-09-02
- Inventor: Chih-Chao Yang , Lynne M. Gignac , Chao-Kun Hu , Surbhi Mittal
- Applicant: Chih-Chao Yang , Lynne M. Gignac , Chao-Kun Hu , Surbhi Mittal
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/532 ; H01L21/768 ; H01L21/02
Abstract:
An interconnect structure including a noble metal-containing cap that is present at least on some portion of an upper surface of at least one conductive material that is embedded within an interconnect dielectric material is provided. In one embodiment, the noble metal-containing cap is discontinuous, e.g., exists as nuclei or islands on the surface of the at least one conductive material. In another embodiment, the noble metal-containing cap has a non-uniform thickness across the surface of the at least one conductive material.
Public/Granted literature
- US20100084767A1 DISCONTINUOUS/NON-UNIFORM METAL CAP STRUCTURE AND PROCESS FOR INTERCONNECT INTEGRATION Public/Granted day:2010-04-08
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