Invention Grant
- Patent Title: Electronic device package and method for fabricating the same
- Patent Title (中): 电子器件封装及其制造方法
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Application No.: US12667383Application Date: 2008-06-13
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Publication No.: US08823179B2Publication Date: 2014-09-02
- Inventor: Chia-Lun Tsai , Wen-Cheng Chien , Po-Han Lee , Wei-Ming Chen , Chien-Hung Liu , Ying-Nan Wen
- Applicant: Chia-Lun Tsai , Wen-Cheng Chien , Po-Han Lee , Wei-Ming Chen , Chien-Hung Liu , Ying-Nan Wen
- Agency: Liu & Liu
- International Application: PCT/CN2008/001145 WO 20080613
- International Announcement: WO2009/140798 WO 20091126
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L27/146 ; H01L21/768 ; H01L23/00
Abstract:
An embodiment of the present invention provides an electronic device package, which includes a chip having a first surface and an opposite second surface and a trench extending into a body of the chip along a direction from the second surface to the first surface, wherein a bottom portion of the trench includes at least two contact holes.
Public/Granted literature
- US20100187697A1 ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-07-29
Information query
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