Invention Grant
US08823180B2 Package on package devices and methods of packaging semiconductor dies
有权
封装器件封装以及封装半导体管芯的方法
- Patent Title: Package on package devices and methods of packaging semiconductor dies
- Patent Title (中): 封装器件封装以及封装半导体管芯的方法
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Application No.: US13493862Application Date: 2012-06-11
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Publication No.: US08823180B2Publication Date: 2014-09-02
- Inventor: Tsung-Ding Wang , Ming-Chung Sung , Jiun Yi Wu , Chien-Hsiun Lee , Mirng-Ji Lii
- Applicant: Tsung-Ding Wang , Ming-Chung Sung , Jiun Yi Wu , Chien-Hsiun Lee , Mirng-Ji Lii
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a bottom packaged die having solder balls disposed on the top surface thereof and a top packaged die having metal stud bumps disposed on a bottom surface thereof. The metal stud bumps include a bump region and a tail region coupled to the bump region. Each metal stud bump on the top packaged die is coupled to one of the solder balls on the bottom packaged die.
Public/Granted literature
- US20130168856A1 Package on Package Devices and Methods of Packaging Semiconductor Dies Public/Granted day:2013-07-04
Information query
IPC分类:
