Invention Grant
US08823183B2 Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package 有权
用于半导体封装的凸块,具有凹凸的半导体封装和堆叠的半导体封装

Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package
Abstract:
A bump for a semiconductor package includes: a first bump formed on a semiconductor chip and having at least two land parts and a connection part which connects the land parts and has a line width smaller than the land parts; and a second bump formed on the first bump and projecting on the land parts of the first bump in shapes of a hemisphere.
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