Invention Grant
US08823183B2 Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package
有权
用于半导体封装的凸块,具有凹凸的半导体封装和堆叠的半导体封装
- Patent Title: Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package
- Patent Title (中): 用于半导体封装的凸块,具有凹凸的半导体封装和堆叠的半导体封装
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Application No.: US12981329Application Date: 2010-12-29
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Publication No.: US08823183B2Publication Date: 2014-09-02
- Inventor: Ki Young Kim , Qwan Ho Chung , Sung Ho Hyun , Myung Gun Park , Jin Ho Bae
- Applicant: Ki Young Kim , Qwan Ho Chung , Sung Ho Hyun , Myung Gun Park , Jin Ho Bae
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2010-0101734 20101019
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L25/065 ; H01L23/31

Abstract:
A bump for a semiconductor package includes: a first bump formed on a semiconductor chip and having at least two land parts and a connection part which connects the land parts and has a line width smaller than the land parts; and a second bump formed on the first bump and projecting on the land parts of the first bump in shapes of a hemisphere.
Public/Granted literature
- US20120091584A1 BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP, AND STACKED SEMICONDUCTOR PACKAGE Public/Granted day:2012-04-19
Information query
IPC分类: