Invention Grant
- Patent Title: Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material
- Patent Title (中): 用于将外部电极固定在压电元件上的焊料和包括焊料的压电元件
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Application No.: US13509521Application Date: 2010-11-22
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Publication No.: US08823245B2Publication Date: 2014-09-02
- Inventor: Franz Rinner , Markus Weiglhofer , Marion Ottlinger , Reinhard Gabl , Martin Galler , Christoph Auer , Georg Kuegerl
- Applicant: Franz Rinner , Markus Weiglhofer , Marion Ottlinger , Reinhard Gabl , Martin Galler , Christoph Auer , Georg Kuegerl
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102009054068 20091120
- International Application: PCT/EP2010/067942 WO 20101122
- International Announcement: WO2011/061335 WO 20110526
- Main IPC: H01L41/083
- IPC: H01L41/083 ; B23K35/00 ; H01L41/293 ; H01L41/047 ; B23K35/26
Abstract:
A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. A piezoelectric component includes such a solder material. The solder material is applied by means of a base metallization.
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