Invention Grant
- Patent Title: Sensor assembly
- Patent Title (中): 传感器组件
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Application No.: US13259252Application Date: 2010-04-02
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Publication No.: US08823365B2Publication Date: 2014-09-02
- Inventor: Alfred J. Santos , Mark E. LaCroix , Lei Wang
- Applicant: Alfred J. Santos , Mark E. LaCroix , Lei Wang
- Applicant Address: US OH North Canton
- Assignee: The Timken Company
- Current Assignee: The Timken Company
- Current Assignee Address: US OH North Canton
- Agency: Michael Best & Friedrich LLP
- International Application: PCT/US2010/029729 WO 20100402
- International Announcement: WO2010/117891 WO 20101014
- Main IPC: G01B7/14
- IPC: G01B7/14 ; G01D5/14 ; G01D5/245

Abstract:
A sensor assembly includes a magnetic track having a plurality of magnetic poles separated by a plurality of pole junctions. The sensor assembly also includes a first magnetic sensor disposed proximate a high-resolution portion of the magnetic track and a second magnetic sensor disposed proximate a reference portion of the magnetic track. The second magnetic sensor spans adjacent pole junctions in the magnetic track. Each of the adjacent pole junctions includes a high-resolution segment corresponding with the high-resolution portion of the magnetic track and a reference segment corresponding with the reference portion of the magnetic track. The reference segment of each pole junction is one of offset and aligned with the corresponding high-resolution segment in each pole junction.
Public/Granted literature
- US20120019234A1 SENSOR ASSEMBLY Public/Granted day:2012-01-26
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