Invention Grant
- Patent Title: Non-contacting sensor assembly
- Patent Title (中): 非接触传感器组件
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Application No.: US12947162Application Date: 2010-11-16
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Publication No.: US08823366B2Publication Date: 2014-09-02
- Inventor: Brian G. Babin
- Applicant: Brian G. Babin
- Applicant Address: US IN Elkhart
- Assignee: CTS Corporation
- Current Assignee: CTS Corporation
- Current Assignee Address: US IN Elkhart
- Agent Daniel J. Deneufbourg
- Main IPC: G01B7/30
- IPC: G01B7/30 ; G01D5/14

Abstract:
A non-contacting sensor assembly including a connector assembly and a magnet assembly. The connector assembly includes a sensor coupled directly to the end of the terminals of the connector assembly. A sleeve is overmolded around and seals the sensor and the terminals. A capacitor is soldered in a recess in the terminals. The terminals include flexible regions, such as regions of reduced thickness, which reduce the effects of thermal expansion/contraction stresses on the solder. In one embodiment, the sensor assembly is a rotary position sensor assembly in which the magnet assembly is molded into a rotatable drive arm assembly located in a housing, the connector assembly is coupled to the housing, and the sensor extends into the housing and into adjacent relationship with the magnet assembly.
Public/Granted literature
- US20110115480A1 Non-Contacting Sensor Assembly Public/Granted day:2011-05-19
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