Invention Grant
US08823366B2 Non-contacting sensor assembly 有权
非接触传感器组件

  • Patent Title: Non-contacting sensor assembly
  • Patent Title (中): 非接触传感器组件
  • Application No.: US12947162
    Application Date: 2010-11-16
  • Publication No.: US08823366B2
    Publication Date: 2014-09-02
  • Inventor: Brian G. Babin
  • Applicant: Brian G. Babin
  • Applicant Address: US IN Elkhart
  • Assignee: CTS Corporation
  • Current Assignee: CTS Corporation
  • Current Assignee Address: US IN Elkhart
  • Agent Daniel J. Deneufbourg
  • Main IPC: G01B7/30
  • IPC: G01B7/30 G01D5/14
Non-contacting sensor assembly
Abstract:
A non-contacting sensor assembly including a connector assembly and a magnet assembly. The connector assembly includes a sensor coupled directly to the end of the terminals of the connector assembly. A sleeve is overmolded around and seals the sensor and the terminals. A capacitor is soldered in a recess in the terminals. The terminals include flexible regions, such as regions of reduced thickness, which reduce the effects of thermal expansion/contraction stresses on the solder. In one embodiment, the sensor assembly is a rotary position sensor assembly in which the magnet assembly is molded into a rotatable drive arm assembly located in a housing, the connector assembly is coupled to the housing, and the sensor extends into the housing and into adjacent relationship with the magnet assembly.
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