Invention Grant
- Patent Title: Evaluation device and evaluation method for substrate mounting apparatus and evaluation substrate used for the same
- Patent Title (中): 用于其的基板安装装置和评价基板的评价装置及评价方法
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Application No.: US13014290Application Date: 2011-01-26
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Publication No.: US08823404B2Publication Date: 2014-09-02
- Inventor: Yasuharu Sasaki
- Applicant: Yasuharu Sasaki
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2010-015629 20100127
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/327 ; G21K5/10 ; G01J1/00

Abstract:
There are provided an evaluation device and an evaluation method for a substrate mounting apparatus capable of simply evaluating a temperature control function of the substrate mounting apparatus depending on evaluation conditions or circumstances and an evaluation substrate used for the same. The substrate mounting apparatus holds a target substrate mounted on a mounting surface and controls a temperature of the target substrate. The evaluation device includes an evacuable airtight chamber in which the substrate mounting apparatus is provided; an evaluation substrate which is mounted on the mounting surface instead of the target substrate and includes a self-heating resistance heater; and a temperature measurement unit which measures a temperature of the evaluation substrate.
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