Invention Grant
US08823407B2 Test assembly for verifying heat spreader grounding in a production test
有权
用于在生产测试中验证散热器接地的测试组件
- Patent Title: Test assembly for verifying heat spreader grounding in a production test
- Patent Title (中): 用于在生产测试中验证散热器接地的测试组件
-
Application No.: US13410040Application Date: 2012-03-01
-
Publication No.: US08823407B2Publication Date: 2014-09-02
- Inventor: Jitesh A. Shah , Errol Monsale
- Applicant: Jitesh A. Shah , Errol Monsale
- Applicant Address: US CA San Jose
- Assignee: Integrated Device Technology, Inc.
- Current Assignee: Integrated Device Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Roeder & Broderup
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
A test assembly (12) for testing a device (10) having a heat spreader (20), a package substrate (18) having a substrate ground (18G), and a grounding conductive segment (44A), includes (i) an input conductive segment (38) that is electrically connected to the heat spreader (20), (ii) a test board (28) having a board ground (30), and (iii) a control system (34) that is electrically coupled to the input conductive segment (38) and the board ground (30). During testing, the device (10) is positioned so that the substrate ground (18G) is electrically connected to the board ground (30). Additionally, the control system (34) directs a test current to one of the input conductive segment (38) and the board ground (30) to test the effectiveness of the grounding conductive segment (44A) including a first electrical interface (45A).
Public/Granted literature
- US20130229201A1 TEST ASSEMBLY FOR VERIFYING HEAT SPREADER GROUNDING IN A PRODUCTION TEST Public/Granted day:2013-09-05
Information query