Invention Grant
- Patent Title: Image processing system with on-chip test mode for column ADCs
- Patent Title (中): 具有片内ADC测试模式的图像处理系统
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Application No.: US12981970Application Date: 2010-12-30
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Publication No.: US08823850B2Publication Date: 2014-09-02
- Inventor: Jeff Rysinski , Yibing Michelle Wang , Sang-Soo Lee
- Applicant: Jeff Rysinski , Yibing Michelle Wang , Sang-Soo Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Main IPC: H04N5/335
- IPC: H04N5/335 ; H03M1/10 ; H04N5/228 ; H04N17/00 ; H04N5/378 ; H04N5/374 ; H03M1/56 ; H03M1/12

Abstract:
An image processing system includes a pixel array including a plurality of regular pixel columns and at least one test pixel column, a plurality of column analog-to-digital converters (ADCs) configured to correspond to the regular pixel columns and convert analog input signals into digital signals, and a switching block configured to provide output signals of the regular pixel columns to input ends of the corresponding column ADCs in a normal mode, and provide in common an output signal of the test pixel column to the input ends of the column ADCs in a test mode, wherein the test pixel column generates signals having a minute voltage different from one row to another row.
Public/Granted literature
- US20120169909A1 IMAGE PROCESSING SYSTEM WITH ON-CHIP TEST MODE FOR COLUMN ADCS Public/Granted day:2012-07-05
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