Invention Grant
- Patent Title: Electronic device housing device
- Patent Title (中): 电子设备外壳设备
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Application No.: US13451658Application Date: 2012-04-20
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Publication No.: US08824137B2Publication Date: 2014-09-02
- Inventor: Takaya Nakayama
- Applicant: Takaya Nakayama
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2011-141243 20110624
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; G11B33/14 ; G11B33/12

Abstract:
An electronic device housing device includes a housing, a plurality of slots that are arranged side by side inside the housing, the slots each housing the electronic device, a gas passage that guides a gas flowing into each of the slots in a direction across the slots, a connection substrate provided inside the housing to extend upright, the connection substrate being arranged to face the slots, the connection substrate including a connected portion to which a connecting portion of the electronic device housed in each of the slots is to be connected, a ventilation port provided at an end portion of the connection substrate, the ventilation port allowing the gas to flow into through the gas passage from each of the slots, and a fan that sucks the gas flowing into each of the slots into the ventilation port through the gas passage.
Public/Granted literature
- US20120327598A1 ELECTRONIC DEVICE HOUSING DEVICE Public/Granted day:2012-12-27
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