Invention Grant
- Patent Title: Heat dissipation system with DIMM baffle
- Patent Title (中): 散热系统配有DIMM挡板
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Application No.: US13525619Application Date: 2012-06-18
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Publication No.: US08824138B2Publication Date: 2014-09-02
- Inventor: Xiu-Zhong Yin , Xiu-Quan Hu
- Applicant: Xiu-Zhong Yin , Xiu-Quan Hu
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110417489 20111214
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.
Public/Granted literature
- US20130155625A1 HEAT DISSIPATION SYSTEM WITH DIMM BAFFLE Public/Granted day:2013-06-20
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