Invention Grant
- Patent Title: Integration of optoelectronics with waveguides using interposer layer
- Patent Title (中): 使用中介层将光电子与波导集成
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Application No.: US13199302Application Date: 2011-08-25
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Publication No.: US08824837B2Publication Date: 2014-09-02
- Inventor: Shen Ren , David A. B. Miller
- Applicant: Shen Ren , David A. B. Miller
- Applicant Address: US CA Palo Alto
- Assignee: The Board of Trustees of the Leland Stanford Junior University
- Current Assignee: The Board of Trustees of the Leland Stanford Junior University
- Current Assignee Address: US CA Palo Alto
- Agency: Lumen Patent Firm
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/10 ; H01L21/20 ; G02B6/136 ; G02B6/13 ; G02B6/132

Abstract:
Improved integration of optoelectronic devices is provided by a spacer layer laterally sandwiched between distinct regions that are monolithically fabricated onto the same substrate (e.g., by selective epitaxy). An optical waveguide in one of the regions can optically couple to an optoelectronic device in another of the regions through the spacer layer, thereby providing a monolithically integrated form of butt-coupling. Preferably, the spacer layer thickness is less than about 50 nm, and is more preferably less than about 20 nm, to reduce optical loss. The spacer layer is preferably electrically insulating, to prevent shorting of devices grown by selective epitaxy.
Public/Granted literature
- US20120219250A1 Integration of optoelectronics with waveguides using interposer layer Public/Granted day:2012-08-30
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