Invention Grant
- Patent Title: Connectivity platform
- Patent Title (中): 连接平台
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Application No.: US12040330Application Date: 2008-02-29
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Publication No.: US08825883B2Publication Date: 2014-09-02
- Inventor: Dmitry A. Anipko , Deepak Bansal , Aaron J. Schrader , Benjamin M. Schultz , Rajesh Sundaram , David G. Thaler
- Applicant: Dmitry A. Anipko , Deepak Bansal , Aaron J. Schrader , Benjamin M. Schultz , Rajesh Sundaram , David G. Thaler
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Agent John Jardine; Andrew Sanders; Micky Minhas
- Main IPC: G06F15/16
- IPC: G06F15/16

Abstract:
Disclosed are a connectivity platform that allows for proprietary connectivity modules to plug into the operating system and also allows the operating system users and various existing networking applications in the operating system that are authorized by those providers to use that connectivity via existing APIs without the need for the applications to change or for extra configuration of the application to be performed. In an example disclosed herein, the providers provide NAT or firewall traversal and implement the appropriate transport mechanism. This allows for applications and computing devices to communicate in environments where connectivity is prevented by intermediate systems.
Public/Granted literature
- US20090222568A1 Connectivity Platform Public/Granted day:2009-09-03
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