Invention Grant
- Patent Title: Adaptive patterning for panelized packaging
- Patent Title (中): 用于镶板包装的自适应图案化
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Application No.: US13893117Application Date: 2013-05-13
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Publication No.: US08826221B2Publication Date: 2014-09-02
- Inventor: Christopher M. Scanlan , Timothy L. Olson
- Applicant: DECA Technologies Inc.
- Applicant Address: US AZ Tempe
- Assignee: DECA Technologies Inc.
- Current Assignee: DECA Technologies Inc.
- Current Assignee Address: US AZ Tempe
- Agency: Booth Udall Fuller, PLC
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G01R31/26 ; H01L21/66 ; H01L23/02 ; H01L23/04 ; H01L23/00 ; H01L23/52 ; H01L23/522 ; H01L21/768 ; H01L23/544
Abstract:
An adaptive patterning method and system for fabricating panel based package structures is described. Misalignment for individual device units in a panel or reticulated wafer may be adjusted for by measuring the position of each individual device unit and forming a unit-specific pattern over each of the respective device units.
Public/Granted literature
- US20130249088A1 ADAPTIVE PATTERNING FOR PANELIZED PACKAGING Public/Granted day:2013-09-26
Information query
