Invention Grant
US08826502B2 Method for making a substantially planar micro-fluid ejection head
有权
制造基本上平面的微流体喷射头的方法
- Patent Title: Method for making a substantially planar micro-fluid ejection head
- Patent Title (中): 制造基本上平面的微流体喷射头的方法
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Application No.: US12786457Application Date: 2010-05-25
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Publication No.: US08826502B2Publication Date: 2014-09-09
- Inventor: David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
- Applicant: David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
- Applicant Address: JP Osaka
- Assignee: Funai Electric Co., Ltd.
- Current Assignee: Funai Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Amster, Rothstein & Ebenstein LLP
- Main IPC: H04R17/00
- IPC: H04R17/00 ; B41J2/16 ; C09J5/02 ; B41J2/14

Abstract:
A process for making a substantially planar micro-fluid ejection head is disclosed, and includes depositing a basic solution on a first surface of a device substrate. The first surface having the basic solution deposited thereon is contacted together with a surface of a support material for a duration ranging from about 1 minute to about 15 minutes, at a temperature ranging from about 20° C. to about 90° C. so that the first surface having the basic solution deposited thereon and the surface of the support material form a bond therebetween to hermetically seal the support material and the device substrate to one another. Both the substrate and the at least one surface of the support comprise silicon, and at least one of the device substrate and the at least one surface of the support material is substantially composed of silicon.
Public/Granted literature
- US20100229391A1 MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS Public/Granted day:2010-09-16
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