Invention Grant
- Patent Title: Spacer wafer for wafer-level camera and method of manufacturing same
- Patent Title (中): 晶圆级相机的间隔晶片及其制造方法
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Application No.: US13296901Application Date: 2011-11-15
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Publication No.: US08826511B2Publication Date: 2014-09-09
- Inventor: George Barnes , Goran Rauker
- Applicant: George Barnes , Goran Rauker
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: B21B1/46
- IPC: B21B1/46 ; H01L27/146 ; B32B3/10
Abstract:
A spacer wafer for a wafer-level camera and a method of manufacturing the spacer wafer include positioning a substrate in an additive manufacturing device and forming the spacer wafer over the substrate. The spacer wafer is formed by an additive manufacturing process.
Public/Granted literature
- US20130122261A1 Spacer Wafer For Wafer-Level Camera And Method Of Manufacturing Same Public/Granted day:2013-05-16
Information query
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