Invention Grant
- Patent Title: Two stage serial impingement cooling for isogrid structures
- Patent Title (中): 用于等网格结构的两级串联冲击冷却
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Application No.: US13195947Application Date: 2011-08-02
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Publication No.: US08826668B2Publication Date: 2014-09-09
- Inventor: Ching-Pang Lee , Jay A. Morrison
- Applicant: Ching-Pang Lee , Jay A. Morrison
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: H01L23/46
- IPC: H01L23/46 ; F23R3/06 ; F01D9/02 ; F01D25/12 ; F01D5/18

Abstract:
A system for cooling a wall (24) of a component having an outer surface with raised ribs (12) defining a structural pocket (10), including: an inner wall (26) within the structural pocket and separating the wall outer surface within the pocket into a first region (28) outside of the inner wall and a second region (40) enclosed by the inner wall; a plate (14) disposed atop the raised ribs and enclosing the structural pocket, the plate having a plate impingement hole (16) to direct cooling air onto an impingement cooled area (38) of the first region; a cap having a skirt (50) in contact with the inner wall, the cap having a cap impingement hole (20) configured to direct the cooling air onto an impingement cooled area (44) of the second region, and; a film cooling hole (22) formed through the wall in the second region.
Public/Granted literature
- US20130031914A1 TWO STAGE SERIAL IMPINGEMENT COOLING FOR ISOGRID STRUCTURES Public/Granted day:2013-02-07
Information query
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