Invention Grant
- Patent Title: Stress-detecting element, sensor module, and electronic apparatus
- Patent Title (中): 应力检测元件,传感器模块和电子设备
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Application No.: US13480000Application Date: 2012-05-24
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Publication No.: US08826748B2Publication Date: 2014-09-09
- Inventor: Tomoaki Nakamura , Tsutomu Nishiwaki
- Applicant: Tomoaki Nakamura , Tsutomu Nishiwaki
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2011-121987 20110531
- Main IPC: G01L1/00
- IPC: G01L1/00

Abstract:
A stress-detecting element includes a support body, a support film, a first piezoelectric element, first and second elastic parts. The support body has an opening part with first and second rectilinear sections extending parallel to each other. The support film blocks off the opening part. The first piezoelectric element straddles the first rectilinear section from an interior area to an exterior area of the opening part as seen in plan view. The first elastic part straddles the first rectilinear section from the interior area to the exterior area of the opening part. The second elastic part straddles the second rectilinear section from the interior area to the exterior area of the opening part. The first and second elastic parts respectively have first and second elastic end sections disposed in the interior area of the opening part and spaced apart from each other.
Public/Granted literature
- US20120304778A1 STRESS-DETECTING ELEMENT, SENSOR MODULE, AND ELECTRONIC APPARATUS Public/Granted day:2012-12-06
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