Invention Grant
- Patent Title: Sensor apparatus with O-ring
- Patent Title (中): 带O型圈的传感器装置
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Application No.: US13528333Application Date: 2012-06-20
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Publication No.: US08826753B2Publication Date: 2014-09-09
- Inventor: Toshinari Kobayashi , Kyungwoo Kim , Masaharu Nakamura
- Applicant: Toshinari Kobayashi , Kyungwoo Kim , Masaharu Nakamura
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agency: Oliff PLC
- Priority: JP2011-138557 20110622
- Main IPC: G01D5/245
- IPC: G01D5/245 ; G01D11/24 ; G01D11/30 ; G01D21/00 ; F16J15/02 ; F16C33/72 ; F16C41/00 ; G01D5/14 ; G01K1/08 ; G01P3/44 ; G01P3/487 ; F16C19/18

Abstract:
A sensor apparatus including a detecting element integrated in a case formed of a synthetic resin material, an O-ring fitted into an annular depression provided on the case, and an O-ring fitting ring member that is formed separately from the case and that is insert-molded in the case, wherein a bottom surface of the annular depression is formed by an outer peripheral surface of the O-ring fitting ring member exposed to an outer surface of the case.
Public/Granted literature
- US20120326398A1 SENSOR APPARATUS WITH O-RING Public/Granted day:2012-12-27
Information query
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