Invention Grant
- Patent Title: Imprinting apparatus, imprinting method, and manufacturing method of uneven plate
- Patent Title (中): 压印装置,压印方法和不平坦板的制造方法
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Application No.: US13234071Application Date: 2011-09-15
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Publication No.: US08826847B2Publication Date: 2014-09-09
- Inventor: Takumi Ota
- Applicant: Takumi Ota
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2011-029984 20110215
- Main IPC: B29C59/02
- IPC: B29C59/02 ; G03F7/00 ; H01L21/027

Abstract:
According to one embodiment, an imprinting apparatus includes an ejecting unit, a stage, a moving unit, and an observation unit. The ejecting unit ejects and drips a hardening resin material onto a substrate to be processed. The substrate to be processed is placed onto the stage. The moving unit relatively moves the ejecting unit and the stage. The observation unit observes the dripped hardening resin material and the pattern with the state in which the dripped hardening resin material and the pattern are overlaid on a plane, before the template is brought into contact with the hardening resin material.
Public/Granted literature
- US20120207931A1 IMPRINTING APPARATUS, IMPRINTING METHOD, AND MANUFACTURING METHOD OF UNEVEN PLATE Public/Granted day:2012-08-16
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