Invention Grant
US08826854B2 Direct-current plasma CVD apparatus and method for producing diamond using the same
有权
直流等离子体CVD装置及使用其制造金刚石的方法
- Patent Title: Direct-current plasma CVD apparatus and method for producing diamond using the same
- Patent Title (中): 直流等离子体CVD装置及使用其制造金刚石的方法
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Application No.: US12654796Application Date: 2010-01-04
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Publication No.: US08826854B2Publication Date: 2014-09-09
- Inventor: Hitoshi Noguchi
- Applicant: Hitoshi Noguchi
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2009-003064 20090109
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/44 ; C23C16/503 ; C23C16/27 ; C23C16/458

Abstract:
The present invention is a direct-current plasma CVD apparatus comprising at least a fixed electrode and a substrate stage having a top flat face and combined with an electrode for placing a substrate, in which the substrate stage top face is not located on a line extended from a center of the fixed electrode in vertical direction, and an angle formed between a line of a length R connecting a center of the substrate stage top face with the center of the fixed electrode and the line extended in vertical direction from the center of the fixed electrode is 90° or less. As a result, there is provided a direct-current plasma CVD apparatus in which a high quality vapor phase growth film, such as diamond of a large area having few defects caused by the fall of the substances produced at the fixed electrode, can be obtained.
Public/Granted literature
- US20100178730A1 Direct-current plasma CVD apparatus and method for producing diamond using the same Public/Granted day:2010-07-15
Information query
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