Some embodiments include methods for removing an edge bead after a photoresist application. Basic solution may be applied to the edge bead and removed with a vacuum, with the basic solution having a pH of at least about 14. Some embodiments include methods of profiling coatings along peripheral regions of substrates. A nozzle may be positioned above a peripheral region and oriented to direct a basic solution downwardly toward the peripheral region. A suction port may be positioned laterally outward of the peripheral region. Basic solution may be ejected from the nozzle toward the peripheral region, with the basic solution having a pH of at least about 14 and dissolving coating along the peripheral region. A vacuum may be provided within the suction port to pull the basic solution and the dissolved coating from the peripheral region.