Invention Grant
- Patent Title: Method and apparatus of heat dissipaters for electronic components in downhole tools
- Patent Title (中): 井下工具电子部件散热器的方法和装置
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Application No.: US12836791Application Date: 2010-07-15
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Publication No.: US08826984B2Publication Date: 2014-09-09
- Inventor: Kerry L. Sanderlin , Jimmie L. Riche, Jr. , Rocco DiFoggio , Vaibhav Bahadur
- Applicant: Kerry L. Sanderlin , Jimmie L. Riche, Jr. , Rocco DiFoggio , Vaibhav Bahadur
- Applicant Address: US TX Houston
- Assignee: Baker Hughes Incorporated
- Current Assignee: Baker Hughes Incorporated
- Current Assignee Address: US TX Houston
- Agency: Mossman, Kumar & Tyler, PC
- Main IPC: E21B36/00
- IPC: E21B36/00 ; E21B47/01
Abstract:
Devices and related methods for reducing a thermal loading of one or more components may include a housing having an interior for receiving the component(s), and a thermally conductive flowable material in thermal communication to the component(s).
Public/Granted literature
- US20110017454A1 METHOD AND APPARATUS OF HEAT DISSIPATERS FOR ELECTRONIC COMPONENTS IN DOWNHOLE TOOLS Public/Granted day:2011-01-27
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