Invention Grant
- Patent Title: Conveyance apparatus
- Patent Title (中): 输送装置
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Application No.: US13572146Application Date: 2012-08-10
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Publication No.: US08827067B2Publication Date: 2014-09-09
- Inventor: Seisaku Iwasa , Motoki Takayama
- Applicant: Seisaku Iwasa , Motoki Takayama
- Applicant Address: JP Kyoto
- Assignee: Ishida Co., Ltd.
- Current Assignee: Ishida Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Global IP Counselors, LLP
- Priority: JP2011-176836 20110812
- Main IPC: B65G47/24
- IPC: B65G47/24 ; B65G21/20 ; B65G21/00 ; B65G43/08

Abstract:
A conveyance apparatus aligns conveyed packaging bags. In the conveyance apparatus, a thickness measurement part measures the thickness of a packaging bag. A controller infers that the width of the packaging bag has decreased when the thickness of the packaging bag is greater than a reference thickness, and the controller causes a first guide member to move so as to approach a second guide member via a guide drive part. In addition, the controller infers that the width of the packaging bag has increased when the thickness of the packaging bag is less than the reference value, and the controller causes the first guide member to move so as to be distanced from the second guide member via the guide drive part.
Public/Granted literature
- US20130037383A1 CONVEYANCE APPARATUS Public/Granted day:2013-02-14
Information query
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