Invention Grant
- Patent Title: Method and apparatus for ripping plate material, and plate material
- Patent Title (中): 剥皮板材和板材的方法和装置
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Application No.: US13172981Application Date: 2011-06-30
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Publication No.: US08827130B2Publication Date: 2014-09-09
- Inventor: Hidenori Inoue
- Applicant: Hidenori Inoue
- Applicant Address: JP Kanagawa
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Jordan and Hamburg LLP
- Priority: JP2010-168691 20100727
- Main IPC: B32B3/00
- IPC: B32B3/00 ; B26F3/02 ; G11B5/48 ; B26F1/40 ; B21D28/16

Abstract:
A method of ripping a plate material having a resilient part, a frame, and an easily breaking part formed between the resilient part and the frame includes holding the frame between an upper pad and a die on a first side of the easily breaking part, moving a punch toward a lower pad that is retractable against pushing force, to clamp the resilient part between the punch and the lower pad on a second side of the easily breaking part, and driving the punch so that the punch guides the plate material and applies tension to the easily breaking part in a surface direction of the plate material, thereby ripping the plate material along the easily breaking part. The method is capable of ripping the plate material without causing burrs.
Public/Granted literature
- US20120027977A1 METHOD AND APPARATUS FOR RIPPING PLATE MATERIAL, AND PLATE MATERIAL Public/Granted day:2012-02-02
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