Invention Grant
US08827166B2 Sealed semiconductor recording medium and sealed semiconductor memory 有权
密封半导体记录介质和密封半导体存储器

Sealed semiconductor recording medium and sealed semiconductor memory
Abstract:
The invention relates to a sealed semiconductor recording medium and a sealed semiconductor memory and provides at low cost a sealed semiconductor memory with high reliability that can allow wireless data communication to be carried out at high speed without interference. At least one semiconductor substrate is provided with a number of read only memory blocks having such a size that the maximum side is 20 mm or less in such a state that the read only memory blocks do not share a power source wire, wherein each of the above-described read only memory blocks has a coil for power reception and a coil for data communication, and data different from each other are written in the above-described read only memory blocks.
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