Invention Grant
US08827166B2 Sealed semiconductor recording medium and sealed semiconductor memory
有权
密封半导体记录介质和密封半导体存储器
- Patent Title: Sealed semiconductor recording medium and sealed semiconductor memory
- Patent Title (中): 密封半导体记录介质和密封半导体存储器
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Application No.: US13377677Application Date: 2010-05-27
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Publication No.: US08827166B2Publication Date: 2014-09-09
- Inventor: Tadahiro Kuroda
- Applicant: Tadahiro Kuroda
- Applicant Address: JP Tokyo
- Assignee: Keio University
- Current Assignee: Keio University
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-141403 20090612
- International Application: PCT/JP2010/058970 WO 20100527
- International Announcement: WO2010/143538 WO 20101216
- Main IPC: G06K19/06
- IPC: G06K19/06 ; H02J5/00 ; H01L27/112 ; H04B5/00 ; H02J7/02

Abstract:
The invention relates to a sealed semiconductor recording medium and a sealed semiconductor memory and provides at low cost a sealed semiconductor memory with high reliability that can allow wireless data communication to be carried out at high speed without interference. At least one semiconductor substrate is provided with a number of read only memory blocks having such a size that the maximum side is 20 mm or less in such a state that the read only memory blocks do not share a power source wire, wherein each of the above-described read only memory blocks has a coil for power reception and a coil for data communication, and data different from each other are written in the above-described read only memory blocks.
Public/Granted literature
- US20120091211A1 SEALED SEMICONDUCTOR RECORDING MEDIUM AND SEALED SEMICONDUCTOR MEMORY Public/Granted day:2012-04-19
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