Invention Grant
US08827214B2 Clamp 有权

  • Patent Title: Clamp
  • Patent Title (中):
  • Application No.: US13574507
    Application Date: 2011-01-26
  • Publication No.: US08827214B2
    Publication Date: 2014-09-09
  • Inventor: Takaya Ogawa
  • Applicant: Takaya Ogawa
  • Applicant Address: JP Yokohama-shi
  • Assignee: Nifco Inc.
  • Current Assignee: Nifco Inc.
  • Current Assignee Address: JP Yokohama-shi
  • Agent Manabu Kanesaka
  • Priority: JP2010-015265 20100127
  • International Application: PCT/JP2011/051401 WO 20110126
  • International Announcement: WO2011/093299 WO 20110804
  • Main IPC: F16L3/08
  • IPC: F16L3/08 F16B21/08 B60R16/02 F16L3/10 F16L55/035
Clamp
Abstract:
A clamp is provided, which includes a clamp main body including a plurality of concave members forming a cylindrical body by combining together, and a fixing device provided in any of the plurality of concave members for fixing the clamp to an attachment object; and an approximately arc-like buffer member disposed on an inner circumferential side of the concave member. On one side surface facing the concave member in the buffer member, a leg portion is formed to bulge out, and on another side surface opposite to the one side surface in the buffer member, an approximately concave-like holding surface is provided. Such clamp can hold long bodies with various diameters, and also can attenuate vibrations of the long bodies.
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