Invention Grant
- Patent Title: Single mount with dual method installation
- Patent Title (中): 单安装双安装方式
-
Application No.: US12861341Application Date: 2010-08-23
-
Publication No.: US08827226B2Publication Date: 2014-09-09
- Inventor: Michael Joseph Townsend , Patrick Leonard Plehn
- Applicant: Michael Joseph Townsend , Patrick Leonard Plehn
- Applicant Address: US MN St. Paul
- Assignee: Ergotron, Inc.
- Current Assignee: Ergotron, Inc.
- Current Assignee Address: US MN St. Paul
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: A47H1/10
- IPC: A47H1/10 ; A47F5/00 ; G06F1/16 ; F16M11/20 ; F16M13/02 ; F16M11/10
Abstract:
A dual method of installing a mounting device to a load-bearing surface includes a mounting device having a back member installed closer to the load-bearing surface than a front member on which an object is mounted. A mounting member is either attached to the back member in a first configuration or the mounting member is attached to the back member in a second configuration. The mounting member is attached to the load-bearing surface such that the load-bearing surface is between the back member and the front member in the first configuration. The back member is between the load-bearing surface and the front member in the second configuration.
Public/Granted literature
- US20120043437A1 Single Mount with Dual Method Installation Public/Granted day:2012-02-23
Information query
