Invention Grant
- Patent Title: Chassis assembly
- Patent Title (中): 底盘装配
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Application No.: US13222815Application Date: 2011-08-31
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Publication No.: US08827323B2Publication Date: 2014-09-09
- Inventor: Yue-Wen Jiang
- Applicant: Yue-Wen Jiang
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corporation
- Current Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corporation
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: CN201010623334 20101231
- Main IPC: E05C1/02
- IPC: E05C1/02

Abstract:
The chassis assembly comprises a main housing, a latching module and a cover plate. The main housing has at least a side plate which has at least one track portion on the inner surface thereof. The latching module is slidably assembled to the side plate and includes a first locking member slidably assembled on the track portion and having at least one retaining portion; an elastic member connected between the latching module and the side plate; and a second locking member assembled with the first locking member and sandwiching the side plate with the first locking member. The cover plate is detachably assembled to the main housing, and includes at least one stator portion corresponding to the retaining portion.
Public/Granted literature
- US20120169197A1 CHASSIS ASSEMBLY Public/Granted day:2012-07-05
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