Invention Grant
- Patent Title: Liquid ejection head
- Patent Title (中): 液体喷头
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Application No.: US13595166Application Date: 2012-08-27
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Publication No.: US08827424B2Publication Date: 2014-09-09
- Inventor: Hisashi Fukai , Naoki Nakajo
- Applicant: Hisashi Fukai , Naoki Nakajo
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc., IP Division
- Priority: JP2011-189346 20110831
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/04 ; B41J2/16

Abstract:
A liquid ejection head includes a recording element substrate including an ejection port that ejects liquid, and an energy generating element that generates energy used to eject liquid, an electric wiring substrate including wiring for transmitting electric power for driving the energy generating element, and an opening that exposes the recording element substrate, a plurality of connecting portions that electrically connect the recording element substrate and the electric wiring substrate, a recess formed between the recording element substrate and the electric wiring substrate, and at least one groove formed in the bottom of the recess corresponding to at least one part where the connecting portions are formed. The at least one groove includes a first portion formed along an arranging direction of the plurality of connecting portions, and a second portion formed in a direction intersecting with the arranging direction.
Public/Granted literature
- US20130050345A1 LIQUID EJECTION HEAD Public/Granted day:2013-02-28
Information query
IPC分类: