Invention Grant
US08827429B2 Method of manufacturing liquid jet head, liquid jet head, and liquid jet apparatus
有权
液体喷射头,液体喷射头和液体喷射装置的制造方法
- Patent Title: Method of manufacturing liquid jet head, liquid jet head, and liquid jet apparatus
- Patent Title (中): 液体喷射头,液体喷射头和液体喷射装置的制造方法
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Application No.: US13401888Application Date: 2012-02-22
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Publication No.: US08827429B2Publication Date: 2014-09-09
- Inventor: Osamu Koseki
- Applicant: Osamu Koseki
- Applicant Address: JP
- Assignee: SII Printek Inc.
- Current Assignee: SII Printek Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2011-037346 20110223
- Main IPC: B41J2/045
- IPC: B41J2/045 ; H01L41/22 ; H04R17/00

Abstract:
In a method of manufacturing a liquid jet head, a piezoelectric substrate is bonded onto a first base. Ejection grooves for ejection channels and dummy grooves for dummy channels are alternately formed in parallel with one another. The ejection grooves and the dummy grooves have such a depth as to pierce the piezoelectric substrate and to reach the first base substrate. An electrode material is deposited on inner surfaces of the ejection grooves and the dummy grooves. A cover plate is bonded to the piezoelectric substrate so as to cover the ejection grooves and the dummy grooves. In a subsequent first base substrate removing step, a part of the first base substrate on a side opposite to the cover plate and the electrode material deposited on bottom surfaces of the dummy grooves are removed. A second base substrate is then bonded to the first base substrate.
Public/Granted literature
- US20120212548A1 METHOD OF MANUFACTURING LIQUID JET HEAD, LIQUID JET HEAD, AND LIQUID JET APPARATUS Public/Granted day:2012-08-23
Information query
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