Invention Grant
- Patent Title: Conductor pattern printing ink
- Patent Title (中): 导体图案印刷油墨
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Application No.: US13325658Application Date: 2011-12-14
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Publication No.: US08827435B2Publication Date: 2014-09-09
- Inventor: Daisuke Uematsu , Kentaro Mori , Nobuhiro Hayakawa
- Applicant: Daisuke Uematsu , Kentaro Mori , Nobuhiro Hayakawa
- Applicant Address: JP Aichi
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-279802 20101215; JP2011-224259 20111011
- Main IPC: C09D11/00
- IPC: C09D11/00 ; C09D7/12

Abstract:
There is provided an ink for printing a conductor pattern on a substrate, including platinum particles, wherein 70% or more of the platinum particles have a particle size of 0.05 to 0.5 μm. Even when the viscosity of the printing ink is controlled to a relatively low level for use in ink-jet printing process, it is possible by such particle size distribution control to prevent sedimentation of the platinum particles and excessive shrinkage of the conductor pattern due to sintering of the platinum particles during firing so that the conductor pattern can attain improved conduction characteristics.
Public/Granted literature
- US20120154494A1 CONDUCTOR PATTERN PRINTING INK Public/Granted day:2012-06-21
Information query
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