Invention Grant
- Patent Title: LED module for lighting
- Patent Title (中): LED模组照明
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Application No.: US13330892Application Date: 2011-12-20
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Publication No.: US08827493B2Publication Date: 2014-09-09
- Inventor: Syota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya , Hideaki Kato
- Applicant: Syota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya , Hideaki Kato
- Applicant Address: JP Kiyosu-Shi, Aichi-Ken
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Kiyosu-Shi, Aichi-Ken
- Agency: McGinn Ip Law Group, PLLC
- Priority: JP2010-283739 20101220
- Main IPC: H05B33/08
- IPC: H05B33/08 ; H05K1/02 ; F21Y105/00 ; F21K99/00 ; F21V25/10 ; F21Y101/02

Abstract:
An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost.An LED module for lighting includes a wiring substrate having a plurality of wiring patterns formed thereon, and a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit. In the LED module, the wiring patterns comprises an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit, the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the wiring patterns with the LED chips, and forms guard electrodes, and both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.
Public/Granted literature
- US20120155086A1 LED MODULE FOR LIGHTING Public/Granted day:2012-06-21
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