Invention Grant
US08827550B2 Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer
有权
使用芯片互连层的振动MEMS谐振器的热传感器
- Patent Title: Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer
- Patent Title (中): 使用芯片互连层的振动MEMS谐振器的热传感器
-
Application No.: US12646833Application Date: 2009-12-23
-
Publication No.: US08827550B2Publication Date: 2014-09-09
- Inventor: Mohamed A. Abdelmoneum , Tawfik M. Rahal-Arabi , Gregory F. Taylor , Kevin J. Fischer , Andrew Yeoh
- Applicant: Mohamed A. Abdelmoneum , Tawfik M. Rahal-Arabi , Gregory F. Taylor , Kevin J. Fischer , Andrew Yeoh
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01K11/00
- IPC: G01K11/00 ; G01K7/32
Abstract:
Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor temperature in an integrated circuit. Fabricating the resonator in an interconnect layer provides a way to implement thermal detection means which is tolerant of manufacturing process variations. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.
Public/Granted literature
- US20110150031A1 THERMAL SENSOR USING A VIBRATING MEMS RESONATOR OF A CHIP INTERCONNECT LAYER Public/Granted day:2011-06-23
Information query
