Invention Grant
- Patent Title: Grounding structure and recording apparatus
- Patent Title (中): 接地结构及记录仪
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Application No.: US13219432Application Date: 2011-08-26
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Publication No.: US08827579B2Publication Date: 2014-09-09
- Inventor: Yasushi Yajima , Daisuke Hiruma , Ryo Hamano , Norihito Harada
- Applicant: Yasushi Yajima , Daisuke Hiruma , Ryo Hamano , Norihito Harada
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2010-193557 20100831
- Main IPC: B41J2/01
- IPC: B41J2/01
Abstract:
A grounding structure achieves a conductive state between members by making contact with the members. One member includes a screw-shaped portion in at least part of the member, and the other member includes an anchoring portion that engages with the screw-shaped portion of the one member under a biasing force in an interlocked state.
Public/Granted literature
- US20120051822A1 GROUNDING STRUCTURE AND RECORDING APPARATUS Public/Granted day:2012-03-01
Information query
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