Invention Grant
- Patent Title: Wafer's ambiance control
- Patent Title (中): 晶圆的氛围控制
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Application No.: US12435861Application Date: 2009-05-05
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Publication No.: US08827695B2Publication Date: 2014-09-09
- Inventor: Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Ming-che Ho , Chien-Ling Hwang , Jui-Pin Hung
- Applicant: Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Ming-che Ho , Chien-Ling Hwang , Jui-Pin Hung
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: F27D15/00
- IPC: F27D15/00 ; H01L21/677 ; H01L21/67

Abstract:
A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.
Public/Granted literature
- US20090317214A1 NOVEL WAFER'S AMBIANCE CONTROL Public/Granted day:2009-12-24
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