Invention Grant
- Patent Title: Wire cable assembly
- Patent Title (中): 电线组件
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Application No.: US13428435Application Date: 2012-03-23
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Publication No.: US08827744B2Publication Date: 2014-09-09
- Inventor: Eric B. Poma , William J. Palm
- Applicant: Eric B. Poma , William J. Palm
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Robert J. Myers
- Main IPC: H01R9/05
- IPC: H01R9/05

Abstract:
A wire cable assembly including a wire cable and a contact element. The contact element is configured to axially receive the wire cable and is formed to attach the wire cable to the contact element. A portion of the contact element is formed to define a single pair of indentation arrangements. The pair of indentation arrangements consists of a first indentation arrangement that diametrically opposes a second indentation arrangement. The contact element may also define a pair of humps adjacent to each of the grooves in the single pair of grooves. The wire cable may further include a conductive inner core, a first insulation layer surrounding the inner core, and an outer wire layer surrounding the first insulation layer. The wire cable assembly may further include an inner ferrule and an outer ferrule with the outer wire layer disposed between the inner ferrule and the outer ferrule.
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