Invention Grant
- Patent Title: Working object cutting method
- Patent Title (中): 工作对象切割方法
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Application No.: US12744727Application Date: 2008-11-18
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Publication No.: US08828306B2Publication Date: 2014-09-09
- Inventor: Naoki Uchiyama
- Applicant: Naoki Uchiyama
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2007-311645 20071130
- International Application: PCT/JP2008/070950 WO 20081118
- International Announcement: WO2009/069510 WO 20090604
- Main IPC: B29C35/08
- IPC: B29C35/08 ; H01L21/78 ; B23K26/08 ; B23K26/00 ; B23K26/40

Abstract:
A working object cutting method capable of cutting a working object precisely is provided. The working object cutting method comprises irradiating a working object 1 with a laser beam while locating a converging point at the working object, so as to form a reformed region in the working object 1 along a reformed-region forming line 15 set at a predetermined distance inside from an outer edge E of the working object 1 along the outer edge, forming a cutting reformed region in the working object 1 along a cutting-scheduled line 5, and cutting the working object 1 along the cutting-scheduled line 5 from a cutting reformed region acting as a start point. Thus forming the working object 1 with the reformed region along the reformed-region forming line 15 set at a predetermined distance inside from the outer edge E of the working object 1 allows the formed reformed region or fissures extending therefrom to inhibit fissures generated in an outer edge portion 25 of the working object 1 from extending to the inside even if a cutting stress is applied to the working object 1 when cutting the working object 1.
Public/Granted literature
- US20100301521A1 WORKING OBJECT CUTTING METHOD Public/Granted day:2010-12-02
Information query
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