Invention Grant
- Patent Title: Imprint method, chip production process, and imprint apparatus
- Patent Title (中): 压印方法,芯片生产工艺和压印设备
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Application No.: US12091836Application Date: 2008-03-17
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Publication No.: US08828307B2Publication Date: 2014-09-09
- Inventor: Shingo Okushima , Junichi Seki , Atsunori Terasaki
- Applicant: Shingo Okushima , Junichi Seki , Atsunori Terasaki
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2007-068628 20070316
- International Application: PCT/JP2008/055354 WO 20080317
- International Announcement: WO2008/114881 WO 20080925
- Main IPC: B29C35/08
- IPC: B29C35/08 ; B82Y40/00 ; B29C37/00 ; B29C43/00 ; B29C43/02 ; B82Y10/00 ; G03F7/00 ; B28B11/24 ; H01J37/02 ; B29C43/58 ; B29C43/36

Abstract:
An imprint method includes contacting an imprint pattern of a mold and a resin material on a substrate. The resin material is cured by irradiating the resin material with light in a state in which the imprint pattern is in contact with the resin material. The mold is parted from the cured resin material, and gaseous molecules are irradiated, in an atmosphere in which the mold is placed, with an electromagnetic wave having a wavelength that is shorter than a wavelength of the light irradiating the resin material. The electromagnetic wave is emitted from an electrification removing light source that is provided in a lateral side of the mold. In the irradiating step, the gaseous molecules are ionized by the irradiation of the electromagnetic wave from the electrification removing light source. The ionized gaseous molecules are supplied into an atmosphere between the substrate and the mold to remove electrification of at least a portion of the mold.
Public/Granted literature
- US20090098688A1 IMPRINT METHOD, CHIP PRODUCTION PROCESS, AND IMPRINT APPARATUS Public/Granted day:2009-04-16
Information query
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