Invention Grant
- Patent Title: Microcontact printed thin film capacitors
- Patent Title (中): 微接触式薄膜电容器
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Application No.: US13795179Application Date: 2013-03-12
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Publication No.: US08828480B2Publication Date: 2014-09-09
- Inventor: Susan Trolier McKinstry , Clive A. Randall , Hajime Nagata , Pascal G. Pinceloup , James J. Baeson , Daniel J. Skamser , Michael S. Randall , Azizuddin Tajuddin
- Applicant: The Penn State Research Foundation
- Applicant Address: US PA University Park
- Assignee: The Penn State Research Foundation
- Current Assignee: The Penn State Research Foundation
- Current Assignee Address: US PA University Park
- Agency: Law Offices of John A. Parrish
- Main IPC: B05D5/12
- IPC: B05D5/12

Abstract:
The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μμm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.
Public/Granted literature
- US20130337153A1 Microcontact Printed Thin Film Capacitors Public/Granted day:2013-12-19
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