Invention Grant
- Patent Title: Electroconductive layer, laminate using the same, and producing processes thereof
- Patent Title (中): 导电层，使用其的叠层及其制造方法
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Application No.: US12352048Application Date: 2009-01-12
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Publication No.: US08828554B2Publication Date: 2014-09-09
- Inventor: Mutsuyuki Kawaguchi , Satoshi Saito , Tsuyoshi Amatani , Yuko Fujii
- Applicant: Mutsuyuki Kawaguchi , Satoshi Saito , Tsuyoshi Amatani , Yuko Fujii
- Applicant Address: JP Amagasaki-Shi
- Assignee: Mec Company Ltd.
- Current Assignee: Mec Company Ltd.
- Current Assignee Address: JP Amagasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2008-022616 20080201; JP2008-257486 20081002
- Main IPC: B32B15/20
- IPC: B32B15/20 ; H05K3/38
Abstract:
The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm.
Public/Granted literature
- US20090197109A1 ELECTROCONDUCTIVE LAYER, LAMINATE USING THE SAME, AND PRODUCING PROCESSES THEREOF Public/Granted day:2009-08-06
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